Dafeng Group Teams Up with Hitachi to Exhibit LED "Heat-Dissipating Aluminum Substrate Forming Machine"

　　In 2011, Dafeng Group once again joins hands with Hitachi for the exhibition. In addition to exhibiting "high-speed drilling machines," the "new generation laser drilling machines," and the most cutting-edge "laser exposure machines," they will also target the green energy trend, specially exhibiting the "heat-dissipating aluminum substrate forming machine" used for LEDs.

　　The "heat-dissipating aluminum substrate forming machine" differs from other machines that use wet processing. Its development focus is to enable LED manufacturers to produce with a "dry-processing forming machine," avoiding the problem of environments that are difficult to manage. It is expected to be favored by the LED industry.

　　Dafeng Group was founded in 1982, with business and service locations spanning Taiwan, mainland China, Hong Kong, Japan, and Korea. Dafeng Group is deeply rooted in the electronics industry, with printed circuit boards (PCB) as its core business, conducting horizontal industry development and expanding into the semiconductor industry, FPD/photovoltaic industry, MEMS technology, energy industry, while simultaneously entering the environmental industry, biochemical industry, nanotechnology and other fields, and then extending from each industry toward the midstream and downstream segments.

　　.