Changelight and Sitan Semiconductor Reach Strategic Cooperation

On May 7, 2026, Xiamen Changelight Optoelectronics Co., Ltd. (hereinafter referred to as "Changelight") announced the formal signing of a strategic cooperation agreement with Xiamen Sitan Semiconductor Co., Ltd. (hereinafter referred to as "Sitan Semiconductor").

Both parties leveragethe advantages of the semiconductor optoelectronics industry cluster in Xiamen Torch High-Tech Zone, deepening collaboration around Micro LED epitaxy, light-emitting chips, and CMOS driver ICs, accelerating the mass production and implementation of automotive Micro LED technology, helping to break the technological monopoly of overseas manufacturers in the automotive display field,and building a closed-loop domestic automotive display ecosystem from core components to system integration.

He Jian, President of Changelight (right), and Yue Xiaowei, President of Sitan (left)

Data shows that Changelight, as a leading domestic semiconductor optoelectronics company, has been deeply engaged in the field of Micro‑LED epitaxial wafers and light-emitting chips for many years. It has established an integrated self-developed mass production system covering epitaxy growth—chip manufacturing—automotive-grade verification, possessing large-scale manufacturing and industrialization capabilities in key processes such as epitaxy growth and COW technology. The company's high quantum efficiency sapphire substrate epitaxy technology is mature and reliable, featuring high temperature resistance, vibration resistance, and long service life, perfectly adapting to harsh operating conditions such as high temperatures and bumps in automotive applications. It is a core upstream supplier for automotive lighting and display scenarios such as ADB adaptive driving beam headlights, with significant technological and production capacity advantages.

Stanley Semiconductor, on the other hand, has deep accumulation in Micro‑LED display technology, CMOS driver ICs, high-precision bonding, white light integration, module packaging and other links. Its automotive solution adopts Die to Die/Wafer to Wafer process combined with AM drive and fully customized drive technology, effectively reducing the cost of large-size modules. It has won directed development contracts and mass production orders from international top Tier 1 suppliers, with key performance indicators leading the industry.

Changelight stated that this cooperation achieves precise complementarity between upstream epitaxial chips + midstream drivers and integration, breaking through the three major barriers of technology, production capacity, and supply chain, pressing the acceleration button for the large-scale commercialization of automotive Micro‑LED.

Automotive displays are one of the most promising large-scale application scenarios for Micro‑LED, where automotive-grade standards impose extreme requirements on reliability, high-temperature resistance, vibration resistance, yield, and cost. Based on a comprehensive assessment of technology maturity, mass production yield, and automotive-grade compatibility, the Die to Die/Die to Wafer process + sapphire epitaxy route is currently the optimal solution for the commercial deployment of automotive Micro‑LED. Changelight and Stan Semiconductor have long focused on this technical route, with products strictly benchmarked against automotive standards:

Changelight: Provides highly reliable sapphire epitaxy and light-emitting chips, solidifying the foundation of upstream materials and devices;

Stan Semiconductor: Provides customized CMOS drivers and high-precision bonding solutions, enhancing system efficiency and cost advantages.

Collaboration between the two parties will further improve yield, reduce costs, and shorten the validation cycle, accelerating the transition of automotive Micro‑LED from the sample stage to large-scale vehicle installation.

Changelight Optoelectronics and Sitan Semiconductor are both core enterprises in Xiamen Torch High-Tech Zone. This strategic cooperation will fully leverage the regional industrial cluster effect, connecting the entire supply chain from Micro‑LED Epitaxy, chips, drivers, integration, and testing to terminal applications. It will strengthen Xiamen's industrial position in the fields of new displays and semiconductors, helping China's Micro‑LED Industry advance towards high-end, large-scale, and global development.

对乾照光电而言，此次合作是公司深化车载显示战略、完善 Micro‑LED产业布局、强化上游核心供应能力的关键一步。该公司表示，未来将持续以技术创新为驱动，携手产业链优质伙伴，打通车规级显示与照明生态，为智能座舱、AR‑HUD、ADB 大灯等高增长场景提供稳定、可靠、领先的核心器件支撑，助力中国车载显示产业实现自主可控与全球领跑。

Source: Changelight Optoelectronics