This LED lighting driver chip manufacturer goes public on the STAR Market today!
On May 22, Maxic Semiconductor went public on the STAR Market of the Shanghai Stock Exchange, officially starting its journey in the capital market.
美芯晟是一家专注于高性能模拟及数模混合芯片研发和销售的集成电路设计企业，主要产品为无线充电系列产品和LED照明驱动系列产品，主要包括高集成度MCU数字控制SoC电源——无线充电芯片，以及模拟电源——LED照明驱动芯片。
近几年，LED照明驱动系列产品收入占美芯晟主营业务收入的比例较高，是公司重要的收入来源。2021年，美芯晟LED照明驱动芯片毛利率由2020年的21.44%上升至41.30%，提升幅度较高。除自身产品的升级对毛利率提升的贡献外，主要还得益于境内外照明市场下游需求旺盛与芯片行业供不应求的双重影响。
Company achieved revenue of 149 million CNY / 372 million CNY / 441 million CNY in 2020, 2021, and 2022 respectively; net profit attributable to the parent company was -11 million CNY / 33 million CNY / 53 million CNY. From January to March 2023, the company's total operating revenue was 80.0534 million CNY, an increase of 44.29% year-over-year, primarily driven by the continuously improving sales of wireless charging chips leading to rapid growth in revenue scale, coupled with stable growth in LED lighting driver chip revenue.
It is reported that the three future growth curves for Maxscend will be LED lighting chips, wireless charging chips, and signal chain chips. Automotive electronic products are also expected to enter large-scale mass production within the next 3 to 5 years. It is projected that the revenue share of mixed-signal chips and signal chain chips will increase significantly.
Maxic's current issuance totals 20.01 million shares, with a total share capital of 80.01 million shares post-issuance. The issue price is 75.00 CNY per share. The company raised 1.501 billion CNY in its initial public offering, with funds primarily allocated to LED smart lighting driver chip R&D and industrialization projects; wireless charging chip R&D and industrialization projects; signal chain chip R&D projects; working capital supplementation; wired fast-charging chip R&D projects, etc.
Among them, the R&D and industrialization project for LED smart lighting driver chips will upgrade and optimize next-generation LED smart lighting products, enhancing functional characteristics of the company's LED smart lighting driver chips in terms of dimming current depth, VDD standby current, PWM dimming frequency range, etc., enrich multi-channel dimming capabilities, and achieve multi-function integration through process optimization, thereby realizing an effective balance between low power consumption and high performance for the company's LED smart lighting chips. This will further promote stable and rapid growth in the business scale of the company's LED smart lighting driver chip products through iterative innovation in product technology.