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2021 Third-Generation Semiconductor Technology Application Innovation Exhibition

Source: China Light Views: 2672


Date: May 13-15, 2021 Venue: Ningbo International Convention and Exhibition Center

  

Organizer: China Solid State Lighting Alliance(国家半导体照明工程研发及产业联盟) (Proposed)

  

Ningbo Strategic Alliance for Technological Innovation in Industry-Academia-Research of Semiconductor Lighting

  

Organizer: Ningbo Electronics Industry Association

  

Executive Organizer: Ningbo Gaosheng International Exhibition Co., Ltd.

  

■ Exhibition Background

  

In recent years, as green low-carbon development and the intelligent interconnection of everything have become a global consensus, a new round of technological and industrial transformation is brewing. Replacing traditional devices with third-generation semiconductors, using healthy and smart light sources to support disruptive innovative applications, transcending lighting to integrate photobiology, light health, and photomedicine, UV light sources pioneering efficient green solid-state purple light technology, and display light sources initiating a new revolution in highly integrated semiconductor information display technology will have a disruptive impact on future human development, changing people's production, lifestyle, and way of thinking.

  

China's third-generation semiconductor industry has a solid technical foundation and a vast application market. The next five years will be an important window period for the rapid development of China's third-generation semiconductor technology and industry. 2020 is a key year for deploying key scientific and technological tasks facing the "14th Five-Year Plan". The "14th Five-Year Plan" and the long-range objectives through the year 2035, which concern the direction of China's future scientific and technological development, are gradually unfolding.

  

From the perspective of the current industry status, China's LED industry is gradually entering a mature phase. It has become the world's largest producer, consumer, and exporter of semiconductor / solid-state lighting (SSL), with advantages in the supply chain. The global market share of the upstream and midstream sectors has significantly increased. In 2020, the output value of third-generation semiconductors reached 703.2 billion yuan (including LED). China possesses R&D capabilities across the entire innovation chain and has initially formed a complete supply chain from materials and devices to applications. However, overall competitiveness remains weak, particularly as core materials and key equipment have become critical bottlenecks.

  

Meanwhile, China has more than 20 national key laboratories, national engineering centers, and national engineering laboratories conducting research on third-generation semiconductor materials. There are over 50 national-level industrialization bases and pilot cities. Excellent manufacturers have begun to emerge in all links, including upstream, midstream, downstream, design, and supporting services, forming a relatively complete innovation, R&D, and industrialization system. China has currently formed a full supply chain ecological innovation entity built on a "four-in-one" model comprising platform companies, research institutes, industrial parks, and industry funds.

  

In order to further strengthen exchanges and cooperation in the global third-generation semiconductor industry, showcase technologies and achievements, and promote "open development and win-win cooperation" in the global third-generation semiconductor industry, the "2021 Third-Generation Semiconductor Technology Application Innovation Exhibition" is scheduled to be held concurrently with the Ningbo International Lighting Expo from May 13-15, 2021.

  

■ Exhibit Scope

  

1. LED lighting, display, and innovative applications

  

Smart lighting, health and medical lighting, facility agriculture lighting, wearable lighting, optical communication, semiconductor landscape lighting, semiconductor security lighting, semiconductor special lighting, semiconductor lighting technology, quantum dots, flexible displays, touch display modules, touch control manufacturing materials and equipment, touch control application software and solutions, etc.;

  

2. Semiconductor optoelectronic devices

  

Light-emitting diodes (LED), infrared light sources, semiconductor light-emitting digital tubes, LED chips, lasers, detectors, etc.;

  

3. Integrated circuit end products

  

Internet of Things (IoT), whole-house smart systems, automotive electronics, laser display applications, holographic display applications, artificial intelligence (AI), industrial control and smart manufacturing.

  

4. Semiconductor Materials

  

Silicon wafers, silicon chips, photoresist, photomasks, CMP polishing materials, photoresist materials, wet electronic chemicals, germanium-silicon materials, SOI materials, silicon materials for solar cells and compound semiconductor materials, quartz products, graphite products, anti-static materials, etc.;

  

5. Semiconductor Production Equipment

  

Single crystal furnaces, oxidation furnaces, diffusion equipment, ion implantation equipment, PVD, CVD, lithography machines, etching machines, polishing machines, coater/developer machines, coating equipment, single wafer deposition systems;

  

6. Semiconductor Packaging and Equipment

  

Thinning machines, dicing machines, die bonders, wire bonders, molding machines, bending equipment, sorters, testers, robotic automation, machine vision, and other material and electronic special-purpose equipment:

  

7. Semiconductor testing and packaging supporting products

  

Probe cards, wire bonding, burn-in testing, automated testing, laser cutting, grinding slurry, dicing fluid, laminated substrates, die attach adhesive, bonding wires, flow control, quartz graphite, SiC, etc.;

  

8. Innovative projects and achievements

  

The latest research results from universities and other scientific research institutions, as well as the display and promotion of high-quality projects from startups and teams.

  

■ Exhibition Fees

  

The 2021 Third-Generation Semiconductor Technology Application Innovation Exhibition offers standard booths (minimum rental 9㎡) and indoor raw space booths (minimum rental 36㎡). The specific booth configurations and prices are as follows:

  


Type

Standard Booth (Minimum Rental 9㎡)

Indoor Raw Space (Minimum Rental 36㎡)

Domestic Enterprises

RMB 10,800/9㎡

RMB 1,100/㎡

Foreign-funded Enterprises

USD 3,000/9㎡

USD $300/sqm

Booth Configuration

· Raw space booth: Provides exhibition space only; does not include display structures, furnishings, special decoration management fees, or electricity fees.
· Standard booth: Bilingual (Chinese/English) fascia board, 1 consultation table, 2 folding chairs, 2 spotlights, 1 power socket, 1 wastebasket.

  

Booth Configuration· Raw space booth: Provides exhibition space only; does not include display structures, furnishings, special decoration management fees, or electricity fees.

  

· Standard booth: Bilingual (Chinese/English) fascia board, 1 consultation table, 2 folding chairs, 2 spotlights, 1 power socket, 1 wastebasket.

  

Note: A 20% opening fee applies for double-sided openings; openings are free of charge for booths of 18 square meters or more.

  

(Application deadline: March 1, 2021)

  

■ Catalog advertising: The catalog has a circulation of 10,000 copies, distributed to attending professional buyers and key purchasers in the organizer’s database.

  

Catalog advertising will ensure your company receives broader exposure during and after the event. (Note: For outdoor advertising, please contact the organizing committee!)

  

Advertising Space

Front Cover

Back Cover

Inside Front Cover

Color First Page

Color Inner Pages

Black and white inner pages

Price

22,000 Yuan

16,000 Yuan

12,000 Yuan

9,000 Yuan

4,000 Yuan

2,000 Yuan

  

■ Exhibition Participation Procedure

  

1: After confirming participation, request the exhibition application form (contract form) from the organizing unit, fill it out, and mail or fax it to the organizing unit;

  

2: Both parties sign the exhibition contract, and the exhibitor pays a 50% deposit or the full amount for the booth within 3 working days;

  

3: Exhibitors must pay the remaining balance before March 1, 2021; otherwise, the organizer reserves the right to adjust or cancel their reserved booth;

  

4: After receiving the full booth fees, the organizing unit will mail the “Exhibitor Manual” to exhibitors one month before the start of the exhibition.

  

■ Contact information of the Organizing Committee

  

Ningbo Gaosheng International Exhibition Co., Ltd. Shanghai Yisheng Exhibition Service Co., Ltd.

  

Tel: +86-574-56881188 Tel: +86-21-62963333

  

Mobile: 18017263799 Mobile: 18017263799

  

Fax: +86-574-56881199 Fax: +86-21-62966328

  

Email: gaoshengguoji@163.com Email: yishengexpo@126.com


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